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In the past, anyone considering the purchase of a high vacuum thin-film system has had to decide whether to purchase a new system from an OEM or buy a refurbished older system.

Today, that choice has dramatically expanded.

Besides rebuilding older systems to meet - and exceed - OEM specs at time of manufacture, SCT has become a full-fledged manufacturer of new systems in its own right.

SCT integrates the key new technologies into older vacuum equipment architectures and the systems fall into three general categories: refurbished to original OEM specs at time of manufacture; upgraded control technologies, and SCT's own new systems. While these systems vary widely in capability and cost, all are remanufactured to the same exacting standards and carry a one year warranty - the longest in the business - and the best documentation and support anywhere.

Refurbished CHA Systems - Mark 50  /  SE-600 & 1000  / Fixturing

High Vacuum Deposition Design

Cha Industries uses a vertical sealing plane on all valves. This design is particularly important on the high vacuum valve. Falling particles will not land on the sealing surface, keeping it leak tight. For less wear and greater reliability, the CHA high-vacuum valve has fewer moving parts than any other in the industry. It also has less surface area than is normally found in valves using a siding gate.

Custom CHA Vacuum Systems

A complete line of CHA equipment makes it easy to select custom systems to fit various vacuum applications and capital equipment budgets. Refurbished options range from manual to fully automatic, plus sources, heaters, and related process instrumentation.

Refurbished MRC Systems - 822  /  903  /  943  /  Parts

Diode Deposition

RF Diode

Deposition of both conductive and insulating materials is performed at typical argon pressures of five to ten microns using a six-inch diameter substrate area.

RF Bias

An adjustable voltage of 2% to 10% of target voltage is applied to the substrates during deposition to enhance purity, density, and adhesion. Voltages of 25 to 200 volts, dependant on the type of material, are typically used. Excess bias leads to heavy argon inclusion in the film.

Magnetron Deposition

This technique of film deposition is the planar magnetron which uses a magnetic field to improve electron utilization in the plasma. This deposition mode results in high deposition rates (e.g., aluminum at 4500 Å/min.) and low substrate temperatures (typically 50°C to 100°C) at operating pressures of a few microns of argon for both RF and DC operation. Sputtering occurs from a circular band defined by the magnetic field.

DC Magnetron

An external five kW DC power supply is used to drive the 6.5" or 8" diameter cathodes when depositing most non-magnetic metallic materials.

RF Magnetron

The standard RF generator can be used to drive magnetron cathodes for depositing any non-magnetic material at deposition rates much faster than those obtained with conventional RF diode operation.

Reactive Sputtering

Oxygen, nitrogen, methane and other gases premixed with argon or mixed using the optional multigas three way manifold can be used for depositing oxides, nitrides and carbides from elemental targets and for maintaining stoichiometry of easily disassociated materials. DC reactive sputtering is frequently used for making resistive films such as tantalum nitride.

Sputter Etching

The full power of the RF generator can be applied to the substrate pallet to provide sputter cleaning. Uniform etching is obtained over virtually the entire pallet.

CPA 9900 Sputtering System

Single sided substrate processing: sputter down, 28 pallets to a load, 12" X 12" usable pallet area.

Horizontal Sputtering System

The CPA 9900 sputtering system has a modular design for short-run production applications.

CVC 601

Process Versatility

With the CVC 601 series Sputter System there are up to 8 process stations with up to 9 process modes available for your specified combination of sputter accessories.

• RF or DC magnetron sputtering
• RF or DC diode sputtering
• RF or DC triode sputtering
• RF bias sputter and preclean
• Ion source clean
• Front and backside heat and preclean

Superior Quality Films

Film uniformity of +/-5% over the entire Rotostrate 7" annulus is readily achieved with single axis, simple rotation. Grain size is easily controlled by adjustments of sputtering parameters.

Designed for Clean Operation

Pinhole defects and particulate contamination are minimized with the sputter up configuration of the CVC 601 and its unchallenged ability to remain clean in normal production environments. The CVC 601 is designed to fit into a clean room or laminar flow hood to maximize process cleanliness. The internal chamber mechanisms are easy to lift out (without special tools) for rapid interchange with clean parts. It's so easy, you can clean the system as often as your process requires and still maintain production schedules.

6" Wafer Handling Capability

Changeover from 2" to 3", 4", 5", 6" diameter substrates or even other geometric configurations (squares, rectangles) within seconds.

QCTª Quick Change Target Design

True Co-Deposition Capability

Sputter two or more dissimilar materials simultaneously for complete control of film stoichiometry.

Load Lock Operation

The 601 series is available in a Load Lock version. The 601 standard system may be upgraded to the 601 Lid Lokª version with a retrofit at a later date as your process requirements change.

Temescal BJD 2400

Manual Load Batch System

VES 2550

Vacuum System Performance

The Temescal BJD 2400 vacuum system pumps down from atmosphere into the 10^-7 range in ten minutes, to 2x10^-7 torr in 30 minutes. The BJD operates in the 10^-6 range with, for example, a half an hour cycle time for 10,000 Å of Al. An 8" CTI Cryogenics pump is mounted off a 7.75" I.D. poppet valve and backed by a floor mounted mechanical pump (to eliminate vibration.)

Under the Chamber Lid

The stainless steel, bell jar shaped lid is 18" dia. by 9" high. Under this spring assisted lid is your choice of deposition fixtures, e.g. TP-8 angle of incidence for lift-off process, the HSP for step coverage, or the TP-2 flat planetary for optical coating. Custom fixturing is available.

Electron Beam Source

A single or multicrucible electron beam source and/or filament assembly can be mounted on the source tray. All of Temescal's e-beam guns incorporate 270° beam deflection to increase filament life, permanent primary magnets to maintain the e-beam on the source, and built in lateral and longitudinal deflection coils to sweep the e-beam.

Source Tray

Easy Access to the source tray (18" dia.) is obtained by a handwheel jackscrew. When lowered the tray swings outward 90°.

Automatic Process Control

Industrial PLC process control can be incorporated into the BJD 2400. The operator then loads the substrates, pushes the start button, and allows the system to run the process automatically.

Varian 3120

Refurbished System

Vacuum Console

The console features four-sided accessability for easy maintenance, and retractable casters for portability. Modular construction of all major components further aids maintainability. All electrical components in the console enclosure are electrically isolated. Plug-in disconnects on electrical components allow a vacuum technician to begin his vacuum service work without the aid of an electrician.

Base Chamber

The stainless steel base chamber assembly is mounted directly above the valve/trap for maximum pumping speed and the valve seals upward to ensure vacuum integrity of the mechanism. The base chamber is equipped with horizontally oriented 1.5" metal-sealed feedthrough ports. Access to the feedthroughs is gained by an easily removed skirt. The chamber baseplate is 3.5" above the console top level and is designed to accept bell jars from 18" to 25.5" in diameter.

Bell Jar Hoist

The bell jar hoist is a smoothly operating electromechanical unit using an industrially rated ball-screw drive. The hoist travels a full 30" to allow maximum access for loading and maintenance work. The bell jar is rotatable 360° on the hoist for cleaning purposes.

MRC 822 Sputtersphere

Sputtersphere

The MRC 822 19" spherical sputtering chamber contains a minimum volume which quickly pumps down. The upper portion of the sphere lifts easily for maintenance and target changing. This used system can be refurbished to meet your requirements.

Sequential Sputtering

The MRC Sputtersphere is designed for sequential sputter deposition, bias sputtering, and sputter etching. The turret head assembly consists of three 8" cathodes mounted on the sides of a stainless steel cube which is supported by a chrome plated shaft. Power and water is supplied to the turret cathodes with safety interlocks. Pneumatic actuation positions the turret head to uniformly align the cathodes to have the same relationship to ground.

Anode

The entire anode assembly is easily removed with a single clamp for cleaning and maintenance. This stainless steel anode is water cooled and hydraulically positioned to the desired cathode to anode spacing.

Vacuum Loadlock

The substrates sit on a pallet which is placed in and removed from the sputtering chamber via an automatic vacuum loadlock. Its small volume is quickly evacuated or inert gas backfilled for the cooldown or heating cycles. The eight" diameter pallets are available in various metals.

MRC 903

Refurbished

Dual Level Loadlock

A dual level loadlock facilitates two pallet operation. Pallets can be introduced into and removed from the system while maintaining process vacuum.

Single Pass Deposition

Substrates coated via single pass method exhibit superior film quality and step coverage by eliminating layer effect associated with multiple pass deposition.

Process Flexibility

RF Magnetron, RF Diode and DC Magnetron capability exists at each cathode/target position for sputtering or evaporation. The refurbished system can be configured to your requirements.

Constant Source to Substrate Distance

Assures that the source material arrives at the substrate possessing relatively uniform energy so that the physical, electrical and adhesion characteristics of the film are consistent.

Substrate Flexibility

In addition to accommodating standard 2 and 3 inch, 100, 125, and 150 mm wafers, substrates of up to 1.5 inches in height can be easily processed. Other heights are available upon special order.

Refurbished Vacuum Systems

Airco-Temescal FC-1800
Evaporator system. With CTI-8 cryopump, auto cryo regeneration, rod fed electron beam gun, 10 kW power supply, X-Y beam sweep, GP 307 vacuum gauge, GE programmable controller.

CHA SE-600
Evaporator system. 10.5 inch diameter stainless steel water cooled chamber. With basic pumping package and auto valve sequence controller.

CHA SE-1000
Evaporator system. 25.5 inch diameter stainless steel water cooled chamber. With CTI-10 cryogenic pump, four pocket electron beam gun, 10 kW power supply, X-Y beam sweep, auto valve sequence controller.

CHA Mark-50
Evaporator system. E-beam evaporation source, Airco-Temescal CV-14 power supply with X-Y beam sweep, Inficon IC-6000, auto valve sequence controller, diffusion pump. CTI Cryogenic pump optional.

CPA 9900
Multi-target In-line sputtering system. Dual load-lock, RF/DC process, substrate heat.

CVC 601
Multi-target sputtering system. Load-lock chamber pumped with CTI-100 turbo pump, process chamber pumped with CTI-8 cryogenic pump, RF/DC process, substrate heat and etch.

MRC 822
Sputtersphere. Four target sputtering system, load-lock, diffusion pump, RF/DC process, substrate heat.

MRC 8667
Three target sputter system

MRC 902
Two target in-line sputter system. Load-lock, CTI-8 cryogenic pump, RF/DC process, substrate heat and etch, auto sequence controller.

MRC 942
Two target in-line sputter system. Load-lock and process chamber pumped with CTI-8 cryogenic pump, 10kW DC power supply, substrate heat.

MRC 903
Three target in-line sputter system. Load-lock, CTI-8 cryogenic pump, RF/DC process, substrate heat and etch, auto sequence controller.

MRC 943
Three target in-line sputter system. Load-lock and process chamber pumped with CTI-8 cryogenic pump, RF/DC process, substrate heat and etch.

Perkin Elmer 4410
Sputter system. Delta or 8 inch cathodes, CTI-8 cryogenic pump, RF/DC process.

Varian/NRC 3117
Evaporator. 19.5 x 30 inch CHA stainless steel water cooled bell jar, standard pumping package, e-gun and power supply.

Varian 3120
Evaporator. 25.5 inch diameter stainless steel water cooled bell jar, diffusion pump.

Varian 3125
Evaporator. 30 inch diameter horizontal stainless steel water cooled chamber. CTI-10 cryogenic pump, four pocket electron beam gun, 10kW electron beam power supply with X-Y beam sweep. Reactive ion.

Vacuum System Service
Expert domestic or international field service and installation is available. Contracts can be custom tailored to your specific needs with warranty on parts, labor, and service. Training classes are taught by qualified instructors with hands-on experience suitable to the mechanics that underlie your system processes. Serving the industry since 1977.

Parts

• Quality new, used or refurbished parts are readily available
• MRC, CHA, Airco-Temescal, Varian, CPA, Perkin-Elmer, others

Rebuilding Services

• Complete vacuum system rebuilding
• General electric PLC and Windows NT interface
• 1.5 kW and 3.0 kW RF generators
• RF tuning networks
• Ion gauge controllers
• Mass flow controllers
• Cassette memory tape drive units
• RF transmission lines
• CTI cryogenic pumps and compressors
• Mechanical pumps (all brands and sizes)
• Chem-clean service for vacuum shielding and parts
• System enhancements and retro-fits
• In-house leak testing

Field Service

• Domestic and international travel (request rate schedule)
• Factory trained master technicians
• System installations
• Training (operation, maintenance, service)