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Sputter
Deposition Systems
In-Line Systems
w/Load Lock Options
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Series)
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w/Load Lock Options
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NEW! High Density
PLASMA System
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SCT-5000
(CHA Mark-50)
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(CHA 1000)
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(VES-2550)
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(BJD, FC & MRC Series)
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Remanufactured Systems
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Fixtures & Components |
System Control Technology has designed a
high vacuum deposition system whose principal feature is its large source
to substrate distance - 48 inches - which allows it to perform true
liftoff on six inch substrates. The
Vector is a load lock box type evaporator completely enclosed in an
electropolished stainless steel cabinet. The system is designed for easy
integration into a clean room and allows easy access to all controls.
The Vector has been designed with
flexibility in mind, and can accommodate a large variety of vapor
deposition equipment deployed in custom configurations. The evaporation
source chamber is maintained under high vacuum at all times. By doing
this, we reduce substrate contamination during evaporation, and achieve
higher evaporation rates as a result of vacuum degas of source material,
resulting in a superior product.
Programmable High Vacuum System
Controller with Data Logging Capabilities
SCT provides as a standard a GE Fanuc PLC industrial controller. This
system includes ladder logic software with required programming for the
SCT Vector. The operator/engineer computer interface includes a GE Fanuc
Display Station 2000 (GE 15" touch screen computer); GE "Cimplicity" HMI,
or equivalent and all required software programming are also provided. The
control system also performs data logging of all key process variables.
Deposition Sources
The electron beam gun is a new six-pocket (100cc) Telemark design. The
source is designed to handle the kilowatt requirements to bridge the 48"
source to substrate distance necessary to perform 90˚ liftoff (±3˚) on 6"
wafers. The unique magnetic design of the gun prevents the beam from
curling within the pocket as material is depleted during the deposition
process, thereby preserving the same beam position at all times.
Substrate Fixture
A rotating dome designed to offer a fixed spherical radius to the
deposition source is supplied with this system. It is a standard lift-off
fixture that presents the substrates to the deposition stream at a precise
90˚ angle, ensuring proper deposition geometry. The liftoff fixture is
driven by a crank arm engaging the center of the come, offset on precision
ball bearings. This crank arm is attached to a feedthrough at the top of
the chamber which, in turn, is connected to a DC motor controlled by the
vacuum system controller. The dome is adjustable in height by adjusting
its drive shaft and the bearing mounting fixture. The dome has a capacity
of twenty-five (25) 6" diameter wafers. Domes designed to carry other
substrate sizes are also available. Blank disks with wafer clips can be
supplied for broken or irregular shaped wafers.
Custom Features
All of SCT's systems are built to customer specifications, making each
system unique. Our engineering department can make any modifications
requested by the client to the basic design so that we can provide a fully
documented custom system, tailored to your specific requirements. |
Model ES-26C Specifications
Chamber Construction
All internal surfaces are electropolished 304 stainless steel.
Frame and Cabinet
Welded steel tube frame; adjustable feet; formed steel panels; enamel finish.
Electron Beam Source
The electron beam source is a new six-pocket, 100cc, Telemark design.
Source tray mounted and fully shielded.
Substrate Fixturing
90˚ angle of incidence liftoff dome designed to hold 25 six inch wafers.
Quartz Crystal Deposition Controller
Multi-layer, multi-process control with nine individual film programs
and total capacity of up to 180 layers. It can support up to three
single head or dual head sensors or one six sensor turret head.
Power Supplies
15kW.
System/Gauge/Valve Controller
GE Fanuc PLC with data logging capabilities.
High Vacuum Pump
Helix CTI-10 on-board cryo pump for the substrate chamber; Helix CTI-400
on-board for the source chamber.
Roughing Pump
The standard pump is an Edwards 180 cfm dual stage mechanical pump. An
Ebara "A", rated at 105 cfm and a base pressure of 30 mtorr is offered as
an option
High Vacuum Pump Isolation Valve
The source chamber uses a VAT 16" gate valve, and the substrate chamber
uses a VAT 10" gate valve..
Roughing Valve
Stainless steel electropneumatically actuated high vacuum bellows sealed
right angle valve.
Vent Valve
Stainless steel right angle valve, electropneumatically actuated.
Viewing Ports
Two 4” view ports with manual shutters to minimize coating of the
viewing surface. Located in upper and lower chamber.
Overall Dimensions
72" high x 72" wide x 30" deep.
Air
Normal, dry lubricated shop air at 70-125 PSIG
Power
208 VAC, 3 phase, five wire, 60 Hz, 60 Amps. A separate supply is
required for each electron beam power supply. Other voltages also available.
Water
Approximately 18 gpm at 40 psi with a maximum temperature of 70˚F.
Gaseous Nitrogen
60 psig.
Custom Configurations Available |