> Sputter Deposition Systems
   In-Line Systems w/Load Lock Options
   - Vertical  (Arrow Series)
   - Horizontal  (Arrow or Axis Series)
   Batch Systems w/Load Lock Options
   - Vertical  (SS Series)
   - Horizontal  (VS Series)
   Drum Coaters
    NEW! High Density PLASMA System

> Evaporation Systems
   Box Coaters  (Orion System)
   Bell Jar Systems
   Load-Lock Systems

> Web Coaters
   Sputtering
   Electron Beam

> Custom Systems

> NEW! Replicated Systems
   SCT-5000  (CHA Mark-50)
   SCT-600  (CHA 600)
   SCT-1000  (CHA 1000)
   SCT-2550  (VES-2550)
   SCT-1800  (BJD, FC & MRC Series)
   SCT Axis Series

> Remanufactured Systems

> Fixtures & Components

Easy Control - The entire system is controlled a touchscreen display. Simple, easy-to-understand screens allow full access and control of process, including robotics. PLC has data logging capabilities and can be networked for centralized control.

A full line of replacement parts - SCT's parts department stands ready to deliver replacement parts at a moment's notice as part of our company's commitment to customer support and satisfaction after the sale. Many of the parts are of our own manufacture, such as cathodes and shielding; others are standard, off-the-self, widely available, and always of the highest quality. The latter include VAT gate valves and CTI cryopumps.

Arrow Modular In-Line Vertical Sputtering System

The SCT in-line vertical/horizontal sputtering system is a high throughput modular design with a pallet size of between 6 and 48 inches, which allows for the addition of deposition, isolation and magazine load-lock chamber modules as specific process requirements demand.

When configured with load-locks, buffer chambers and operator load and unload stations, the SCT in-line sputter system is fully automated with continuous feed carriers for high throughput. The system has the capability of sputtering onto both sides of the substrate carriers simultaneously while providing the option of substrate backside heat through the middle of the two-sided pallet. Also multipass deposition is available.

It is a high performance system which utilizes widely available, long lasting, high quality components.

Programmable High Vacuum System Controller with Data Logging Capabilities
SCT provides as standard a PLC control system which includes ladder logic software with any custom programming for the SCT Arrow. The operator/engineer computer interface includes a touch screen display, HMI, and all custom software programming. The control system also can perform data logging of all key process variables.

Custom Features
All of SCT’s systems are built to customer specifications, making each system unique. Our engineering department can make any desired modifications to the basic design so that we can provide you with a fully documented custom system tailored to your specific requirements.

Here are some of the features which are available:

• Cassette-to-cassette robotic substrate handling
• Dual substrate pallets with central substrate heater for dual sided deposition and heating
• RF etching
• RF or DC substrate bias
• Ion beam cleaning
• Reactive deposition
• Through-the-wall clean room installation
• Load and unload from one end of the system to minimize clean room space and use only one robot arm
• Total automation; no need for human intervention under normal conditions

Load-Lock Modules and Carrier Load/Unload Stations
The load-lock modules and load and unload stations allow for continuous automatic, atmosphere-to-atmosphere processing of carriers through the system. The carriers are automatically fed into the load-lock entrance, then through the pumping chamber, and into the deposition chamber.

The addition of the pumping chamber allows for pallets to be positioned in the deposition chamber a mere few inches from each other, thereby optimizing throughput.

Deposition Module

The deposition chamber can be configured with RF and DC cathodes, on one or both sides of the pallet, in whatever numbers necessary to complete the process in one pass. The modularity of the Arrow also allows for the addition of more cathodes as processes change and throughput demands increase.
    Each opposing pair of cathodes has its own power supply and cryopump.

Specifications

• Chamber Construction
  All internal surfaces are electropolished 304 stainless steel. The process chamber consists of a same-sided box with dimensions ranging from 27” to 48”.
• Frame and Cabinet
  Welded steel tube frame; adjustable feet; formed steel panels;  baked enamel finish.
• Sputter Sources
  A variety of RF and DC cathodes are available.
• Substrate Carriers
  Electropolished stainless steel with bartemp bearings.
• System/Gauge/Valve Controller
  GE Fanuc PLC with data logging capabilities.
• High Vacuum Pump
  Cryopump for clean, high speed pumping. Pumping speed dependent on cryopump size. Other types of pumps optional.
• Roughing Pump with Blower Option
  Size commensurate with chamber volume.
• High Vacuum Pump Isolation Valve
  Electropneumatically actuated stainless steel gate valve isolates the high vacuum pump from the process chamber. Size commensurate with chamber volume.
• Roughing and Foreline Valves
  Stainless steel electropneumatically actuated high vacuum bellows sealed right angle valve.
• Vent Valves
  Stainless steel right angle valve, electropneumatically actuated.
• Viewing Ports
  4” view ports with manual shutters to minimize coating of the viewing surface and 2.75” metal sealed flange RGA port.
• Air
  Normal, dry lubricated shop air at 70–100 psig.
• Power
  208-240/38-440 VAC, 3 phase, five wire, 50/60 Hz, 100 Amps. A separate supply is required for each cathode power supply. Other voltages also available.
• Water
  Approximately 8-20 gpm at 60 psi with a maximum temperature of 70ºF.
• Gaseous Nitrogen
  10 psig.

Custom Configurations Available

Axis Sputtering System

The SCT Axis series sputter systems were designed with flexibility in mind and have a proven track record of reliability.

All Axis sputter systems have load-locks for high throughput and come with a choice of two (Axis II), three (Axis III) and four (Axis IV) target configurations. RF magnetron, RF diode and DC magnetron cathodes are available at each cathode position. Two styles of cathodes are offered: planar and inset, the latter allowing for three distinct target shapes.

Load-Lock and Process Chambers
The Axis processes one pallet at a time, but the addition of a two-level load-lock allows for simultaneous loading and unloading of pallets while sputtering and etching takes place in the process chamber.
This horizontal sputter system has multipass scanning capability - if a particular cathode cannot deposit enough material on the substrate on one pass as called for in a particular process, the system has the capacity to reverse direction, and continue as often as needed.
The cathodes are all equipped with cross contamination shields which prevent adjacent target contamination during sputtering.
The RF etch station is standard, and contained inside the process chamber thereby reducing the substrates' exposure to atmosphere. The etch platform is water-cooled and pneumatically actuated. It operates by lifting the pallet off the pallet carrier for etching. A shutter, placed directly above3 the pallet, acts as an etch catcher and a ground plane.
The RF generator and the DC power supply are housed under the chamber within the system's frame. A 10kW DC power supply is standard, with an option for 20 kilowatts. For RF magnetron or diode operations, standard power is 1.5kW, with 3kW optional.

Programmable High Vacuum System Controller with Data Logging Capabilities
SCT provides as a standard a PLC control system which includes ladder logic software with required programming for the SCT Axis, written specifically to accommodate customer specifications. The operator/engineer computer interface includes a touch screen display,  HMI, and all required software programming. The control system also can perform data logging of all key process variables.

As an option, SCT can customize reports of the data to meet specific customer requests.

Custom Features

All of SCT’s systems are built to customer specifications, making each system in some ways unique. Our engineering department can make any desired modifications to the basic design so that we can provide you with a fully documented custom system tailored to your specific requirements.

Here are some of the features which are available:

• Hi-vacuum load-lock with the addition of cryopump for shorter cycle times
• Substrate heat available for both load-lock and process chamber
• Load-lock cooling by adding an inert gas to the load-lock
• Two, three and four cathode configurations—any combination of planar and inset, RF or DC
• Inset style cathodes can be outfitted with three separate target material shapes—one at a time, of course
• Can be configured with up to four process gases
• RF voltage stabilization
• DC bias capability includes internal mechanism to apply DC power to the pallet. This option includes a 150V power supply.

Specifications

• Chamber Construction
  Chamber is made of electropolished 304 stainless steel. The process chamber has a top cover which is hinged at the rear and lifted hydraulically.
• Load-lock
  Load-lock has two levels, one for unprocessed pallets which are loaded above, and processed pallets which are unloaded at lower level.
• Etch Platform
  RF etch station contained within the process chamber.
• Frame and Cabinet
  Welded steel angle frame; adjustable feet; formed steel panels; baked enamel finish.
• Cathodes
  The system accepts two, three or four cathodes. There are two types of cathodes available: inset and planar diode or magnetron. Size is 4.75” x 14.875”.
• Pallet
  Pallet size is 12.25”x 12.25” with a capacity of between 36-2” and 4-150mm wafers. Substrate thickness can be up to 1 inch.
• Quartz Crystal Deposition Controller
  Multi-layer, multi-process control with nine individual film programs and total capacity of up to 180 layers. It can support up to three single head or dual head sensors or one six sensor turret head.
• Power Supplies
  1.5 and 3kW for RF; 10 or 20kW for DC
• System/Gauge/Valve Controller
  GE Fanuc PLC with data logging capabilities.
• High Vacuum Pump
  CTI-8 cryopump for clean, high speed pumping; CTI-10 cryopump optional. Cryopump also optional for load-lock.
• Roughing Pump
  One 50 cfm mechanical pump.
• Hi-vacuum Valve
  Stainless steel 8” gate valve, electropneumatically actuated.
• Roughing, Foreline and Isolation Valves
  Stainless steel, electropneumatically actuated, high vacuum bellows sealed 1.5” valves.
• Viewing Ports
  One view port for the load-lock, one for each cathode, and one for the etch station. All view ports have manual shutters.
• Air
  Normal, dry lubricated shop air at 70–100 psig.
• Power
  208 VAC, 3 phase, five wire, 60 Hz, 60 Amps, 380/440 volts, 50Hz and other voltages also available.
• Water
  Approximately 5 gpm at 60 psi with a maximum temperature of 70ºF.
• Sputtering Gas
  Typically 10 psig argon.