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A Custom System with Multiple Sources

- Electron Beam Source
- Wafer Therma/Sources
- Resistance Thermal Sources
- DC Sputter Source
- RF Sputter Source
- ION Beam Source
- Effusion Cell Source
- Laser Ablation Source		 Optical Fiber Metallizing System

BENEFITS
Pure evaporated metals with no possible electrolyte contamination

Low stress nickel solder barrier eliminates use of Platnimu or Palladium

Only precious metal needed is Gold

Solderable in hard and soft wolders

Tensile strength in excess of 200 KPSI

Customized metal layers available, e.g. Sn, Er, Ta

End and window strips of fiber ribbons available to meet customer requirements

Coating Specs

Tri-metal coating of Ti-Ni-Au
featuring low stress Nickel coatings

Ti layer ~0.01µ

Nickel layers 0.25-2.5µ
(application specific)

Gold layer 0.5-1µ

>200Kpsi tensile strength

Metal length 5-25 cm

Glass length from window strip greater than 6 cm

Description

The system uses a proprietary non line-of-sight process using Ti, Ni and Au for metallizing optical fibers. This technique yields uniform adherent layers of metal than withstands solder re-flow and maintain integrity of strength and has the advantage of depositing low stress Nickel films, alleviating the need for Platinum or Palladium for the solder "barrier" layer.
© 2005 System Control Technologies